JPS646554B2 - - Google Patents
Info
- Publication number
- JPS646554B2 JPS646554B2 JP19682582A JP19682582A JPS646554B2 JP S646554 B2 JPS646554 B2 JP S646554B2 JP 19682582 A JP19682582 A JP 19682582A JP 19682582 A JP19682582 A JP 19682582A JP S646554 B2 JPS646554 B2 JP S646554B2
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- layer metal
- layer
- film
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 125
- 239000002184 metal Substances 0.000 claims description 125
- 238000005530 etching Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 229910000510 noble metal Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000010301 surface-oxidation reaction Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229940107816 ammonium iodide Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- -1 potassium ferricyanide Chemical compound 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19682582A JPS5987848A (ja) | 1982-11-11 | 1982-11-11 | 半導体集積回路基板電極膜の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19682582A JPS5987848A (ja) | 1982-11-11 | 1982-11-11 | 半導体集積回路基板電極膜の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5987848A JPS5987848A (ja) | 1984-05-21 |
| JPS646554B2 true JPS646554B2 (en]) | 1989-02-03 |
Family
ID=16364286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19682582A Granted JPS5987848A (ja) | 1982-11-11 | 1982-11-11 | 半導体集積回路基板電極膜の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5987848A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432967A (ja) * | 1990-03-19 | 1992-02-04 | Hitachi Ltd | 臨床検査総合情報システム |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6002172A (en) * | 1997-03-12 | 1999-12-14 | International Business Machines Corporation | Substrate structure and method for improving attachment reliability of semiconductor chips and modules |
| JP2001284749A (ja) * | 2000-03-29 | 2001-10-12 | Matsushita Electric Ind Co Ltd | プリント配線板 |
| JP2007103840A (ja) * | 2005-10-07 | 2007-04-19 | Nec Electronics Corp | 電子回路装置の製造方法 |
| JP2007103816A (ja) * | 2005-10-07 | 2007-04-19 | Nec Electronics Corp | 配線基板および電子回路装置 |
-
1982
- 1982-11-11 JP JP19682582A patent/JPS5987848A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432967A (ja) * | 1990-03-19 | 1992-02-04 | Hitachi Ltd | 臨床検査総合情報システム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5987848A (ja) | 1984-05-21 |
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